The Telecommunications Industry Association (TIA) said today OSP EXPO will co-locate at next years GLOBALCOMM event in Chicago.
GLOBALCOMM is TIAs branch-off of SUPERCOMM, of which this years show is the last. SUPERCOMM was a joint effort between the TIA and the United States Telecom Association (USTA).
GLOBALCOMM is scheduled for June 5-8, 2006, at McCormick Place. It will feature education sessions, an expo floor and continued focus on IPTV, VoIP, VoD and other next-generation technologies.
OSP EXPO specializes in telecom network education and will bring together OSP professionals from the ILEC, IOC and CLEC communities to demonstrate more than 250 of the latest OSP technologies, more than 50 seminars and more.